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24.2.5.2 Types. Numerous materials are available that are sold as backup material. Few of the materials used as backup materials are actually specifically engineered for circuit board drilling. Many of the popular backup products are composites with a variety of surface coatings or skins bonded to several different core materials. Available backup products include the following:

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Epoxy-paper-clad, wood-core composite utilizing a bonding agent with lubricating properties Aluminum-clad, wood-core composite Epoxy-paper-clad, wood-core composite Melamine-clad, wood-core composite Urethane-clad, wood-core composite Solid phenolic Aluminum-clad phenolic composite Plain wood Hardboard

24.2.5.3 Performance. Desired qualities in a backup material are minimal thickness variations, flatness (no bow, warp, or twist), no abrasives or contaminants, a smooth surface, low cutting energy (minimizing drilling temperatures), and a surface hardness that supports the laminate copper surface (to prevent burrs) yet does not cause damage or extensive wear to the drill bit. Backup materials with lubricating properties have been proven to significantly reduce drilling temperatures by as much as 50 percent or more, often resulting in temperatures below the Tg of the laminate product being drilled. This advantage greatly reduces hole wall defects such as roughness, smear, and nail-heading and often allows increased drill stack heights and/or greatly increased drill bit maximum hit counts. The importance of these benefits is significant reduction in drilling cost per hole and improved productivity and yield. Remember that drilled backup debris exits the stacks by passing through the holes in the laminate material and that therefore contamination (from the backup material) is of great concern. Materials containing phenolic, or composed of solid phenolic, are not suitable for circuit board drilling. Phenolic materials or phenolic composites (i.e., aluminum-clad phenolic) often warp and under most drilling conditions contaminate the hole wall, which results in problems with adherence of the plating because desmearing chemicals are not designed to remove phenolic resin. Hardboard types of materials cannot be maintained to thickness variation tolerances acceptable for circuit board drilling and are a source for a great variety of contaminants (e.g., oils crystallized on the surface for hardening purposes).

Tooling Pins Seldom is any due attention given to the tooling pins.They come in many shapes and sizes and their cost, with respect to how much they add to the cost of fabricating a circuit board, is insignificant. Yet, quite often, tooling pins are found to be damaged or deformed (e.g., mush-

and tested until they break. The load at breakage should be recorded. Use Eq. 1.2 to calculate the flexural strength. S = 3PL/2bd2 where S = Flexural strength (psi) P = Load at breakage (lb.) L = Span (in.) B = Width of specimen (in.) D = thickness (in.) (12.2)

12513 Copper Peel Strength (Before and After Thermal Stress) Test methods are described in Section 1242 and results can be transferred to this point in the evaluation To complete the data, perform additional tests if necessary after specific thermal stress (solder dip, reflow with different peak temperatures, and/or different dwell times) or after exposure to plating solutions 1252 Thermomechanical Tests Properties that are tested thermomechanically include Tg, CTE, thermal resistance, solder dip resistance, and solder float resistance 12521 Glass Transition Temperature Tg (DSC, TMA, and DMA) The resin systems used in today s copper-clad laminates are almost all three-dimensionally cross-linked thermoset polymers This means that the materials are manufactured (in a curing reaction) into a hard final product and cannot be remelted many times the way thermoplastic polymers can.

In many cases, different resin systems are blended to create a material with specific properties The functionality of the individual resins and their ratio in the blend define the properties of the thermoset The degree of cure of the hardened thermoset resin system can be described by characteristics such as percent of uncured monomer and heat of final cure or by mechanical properties such as hardness, modulus, and yield stress But one of the most commonly used characteristics to describe the degree of cure and cross-link density of a thermoset polymer is the glass transition temperature (Tg) The simplest definition of the Tg of a laminate is to call it the temperature at which the mechanical properties of a laminate change (deteriorate) rapidly It is at this temperature that the polymer changes from a rigid, brittle, and glasslike state to a softer and more rubberlike material.