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20. Shipley, C. R., U.S. Patent 5,246,817, September 21, 1993. 21. Sakamoto, Kazunori, Yoshida, Shingo, Fukuoka, Kazuyoshi, and And , Daizo, The Evolution and Continuing Development of ALIVH High-Density Printed Wiring Board, presented at IPC Expo 2000; featured in Circuit Tree, May 2000, pp 34 37. 22. Itou, Motoaki, High-Density PCBs Provide for More Portable Design, http://www.nikkeibp.com/ nea/nov99/tech/. 23. Microvia Substrates: An Enabling Technology for Minimalist Packaging 1998 2008, BPA Group Ltd., 1999, pp. 4 3 to 4 17. 24. Tsukada, Yutaka, et al., Surface Laminar Circuit and Flip Chip Attach Packaging, Proceedings of the Seventh IMC, 1992. 25. Tsukada, Yutaka, Introduction to Build-Up Printed Wiring Board (in Japanese), Nikkan Kogyo Shinbun, 1998. 26. Holden, Happy, Special Construction Printed Wiring Boards, Printed Circuit Handbook, 4th ed., Clyde F. Coombs, Jr. (ed.), McGraw-Hill, 1995, chap. 4. 27. Takahashi, Akio, Thin Film Laminated Multilayer Wiring Substrate, JIPC Proceeding, Vol. 11, No. 7, November 1996, pp. 481 484. 28. Shiraishi, Kazuoki, Any Layer IVH Multilayer Printed Wiring Board, JIPC Proceeding, Vol. 11, No. 7, November 1996, pp. 485 486. 29. Fukuoka, Yoshitaka, New High Density Printed Wiring Board Technology Named B2it, JIPC Proceeding, Vol. 11, No. 7, November 1996, pp. 475 478. 30. Apol, Tim, Directional Plasma Etching Straight Sidewalls, No Undercut, PC Fabrication, Vol. 20, No.12, December 1997, pp. 38 40. 31. Tsuyama, Koichi, et al., New Multi-Layer Boards Incorporating IVH: HITAVIA, Hitachi Chemical Technical Report, No. 24, 1995-1, pp. 17 20. 32. Tokyo Ohka Company Brochure. free qr code excel plugin QR Code Excel Generator Add-in: Create QR-Code barcode image ...
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Well, in Excel there is no default option to generate a barcode . But you can generate it installing a separate font. Today, just for you, I'd like to reveal. 1. Coors, G., Anderson, P., and Seward, L., A Statistical Approach to Wiring Requirements, Proceedings of the IEPS, 1990, pp. 774 783. 2. Sutherland, I. E., and Oestreicher, D., How Big Should a Printed-Circuit Board Be IEEE Transactions on Computers, Vol. C-22, No.5, May 1973, pp. 5323 5542. create qr code excel free qr code in excel 2003 erzeugen : CAM DESIGN HANDBOOK in ...
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I have created a spreadsheet with my scrapbooking inventory detail. I want to use QR codes to put on bags of items to tell me what is in the ... Since the introduction of HDI in the mid-1980s (HP-Finstrate, Siemens s MicroWiring, and IBM s Surface Laminar Circuit [SLC] technology; see Figs. 22.1, 22.2, and 22.3), many variations of making high-density interconnect (HDI) wiring boards have been developed and implemented for mass production. However, if one technology is to be judged in terms of volume produced and picked as a winner, laser-drilling technology is the one. Other methods are still used by a number of printed wiring board (PWB) manufacturers, but on a much smaller scale. The purpose of this chapter is to examine a variety of HDI fabrication processes as seen in Fig. 23.1. However, a greater emphasis will be placed on the laser-drilling process (hereinafter laservia) since it is the most popular process today and it seems its popularity will grow in the future. It must be understood that interconnect via hole (IVH) formation is just one element of fabricating HDI wiring boards. The other two important factors are the various dielectric materials and the methods of metallization. Fabrication of HDI wiring boards with microvia holes involves many new processes not common to conventional board fabrication. Therefore, additional emphasis will be placed upon these new fabrication processes that are common to other microvia technologies. qr code generator excel mac Free Download Excel 2016/ 2013 QR Code Generator. No barcode ...
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Easily create QR Code barcode in Excel without understanding any programming skills. Download Free Trial Package | Users Tutorial included. The 21 different HDI processes shown in Fig. 23.1 have three basic fabrication factors in their process makeup: The boxes titled Speaking of . . . give you de nitions or describe topics that might give you added credibility when you take the stage. You ll nd everything from ways to avoid procrastination and quotes that will make you think to memory techniques and safety tips in these boxes. FIGURE 23.1 The HDI technologies in use today are made up of three factors: the dielectric materials, the methods of IVH formation, and the method of metallization of those z-axis via connections. In recent years up until now, 21 different HDI processes have been used. Dielectric Materials Eight different general dielectric materials have been used in the current or past HDI processes. IPC slash sheets such as IPC-4101B and IPC-4104 cover many of these, but many are not yet specified by IPC standards. The materials are: Photosensitive liquid dielectrics Photosensitive dry-film dielectrics Polyimide flexible film Thermally cured dry films Thermally cured liquid dielectrics Resin-coated copper (RCC) foil Conventional FR-4 cores and prepregs Thermoplastics Interconnect Via Hole Formation Seven different methods of forming the IVHs have been used in current or past HDI processes. Laser drilling is the most prominent, but the other six come into use also. The methods are: Photo processes to define vias in photodielectrics Various laser-drilling methods, including UV-Yag, UV-Eximer, and CO2 Mechanical drilling Plasma drilling Screen printing of via pastes Photo and etch of solid vias Toolfoil Method of Metallization Four different methods of metallizing the IVHs have been used in the current or past HDI processes. The methods are: Fully additive electroless copper Conventional electroless and electroplating copper Conductive pastes Fabricating solid metal vias Very slim volume, covers topics quickly in a few pages It kind of has a mathematically formal prose.. The three basic and original HDI processes are laser drilling laminate (Finstrate) and flexible materials (microwiring), photodielectrics with SLC and plasma-etching polyimide (Dycostrate). These and the other 18 HDI processes have been integrated into standard printed circuit manufacturing flows. There is no standard way to organize these processes, but the method of IVH formulation is the most unique characteristic of each process and will be used for this purpose. Photo-Via Technologies 1,2 23.1.1 IBSS-AAP10 System. The Interpenetrating Polymer Network Build-Up Structure System (IBSS) is a new photodielectric. This photo-imageable dielectric (PID) is a proprietary photodielectric developed by Ibiden of Japan. It complements Ibiden s older epoxy type of photo-redistribution layer technology, IP-10. 23.3.1.1.1 Structure. IBSS is specifically formulated for integrated circuit and flip-chip packages and has a high Tg and flexibility. The bismalene-triazine(BT) core also provides hightemperature resistance. A typical IBSS structure and its features are illustrated in Fig. 23.2. 23.3.1.1.2 Manufacturing Process. IBSS is a liquid system applied by roller coater to a rigid core, typically BT. The coating is cured and photodeveloping creates the vias. The IBSS requires an aggressive swell-and-etch because of the higher-temperature nature of the photo-dielectric (PD). The metallization is fully additive copper, also proprietary to Ibiden. create your own qr codes in excel How to create qr code based on cell value in Excel ? - ExtendOffice
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