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PALAP boards also give due consideration to the environment, one of the major issues requiring action in the area of electronics products, including those used in information technology and automobiles. Because PALAP boards use thermoplastic resin as their base material, they enable material recycling in which only the resin is separated and reused. 23.3.2.12 VIL. The VIL (Victor Interconnected Layers) HDI technology was developed by Victor of Japan. It utilizes FR-4 prepreg materials that are laser-drilled and sequentially laminated after the vias are filled with a conductive paste. Figure 23.26 shows the typical manufacturing sequence for this HDI technology. 23.3.3 Mechanical Drill-Via Technologies (See Fig. 23.6) Hitachi HITAVIA is an example of the mechanical drill-via technologies available. 23.3.3.1 HITAVIA. The Hitachi HITAVIA technology is the only HDI process developed for use with conventional mechanical drilling. It utilizes RCC or prepreg materials that are mechanically drilled and sequentially laminated after the vias are filled with a conventional electroless copper and copper plating.The typical manufacturing sequence for this HDI technology is similar to that of previously described HDI processes such as CLLAVIS and PPBU. 23.3.4 Plasma-Via Technologies (See Fig. 23.7) Plasma-via technologies include DYCOstrate, plasma micromilling, and plasma-etched redistribution layers (PERL). 23.3.4.1 DYCOstrate. Starting in 1989, Dr. Walter Schmidt of Contraves in Switzerland developed the plasma-etching process for microvias. Evolving from the traditional plasma desmear process, the plasma etcher for vias was jointly developed by Dyconex (successor to Contraves) and Technic Plasma of Germany. Dyconex trademarked and patented its viageneration process as DYCOstrate. Hewlett Packard licensed the technology in 1993 and developed it for mass, low-cost production. The low-cost production process of Hewlett Packard is called PERL (for plasma-etched redistribution layers).

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DYCOstrate, along with SLC and Finstrate, is among the most enduring production processes for microvias generation The DYCOstrate process was first employed for highreliability military, aerospace, medical, and IC packaging starting in 1991 Since that time, Dyconex has used the process to produce hundreds of different printed boards both in polyimide film and with the new laminates called FR-4 RCC This Dyconex called DYCOstrate-C 233411 Structure Figure 2327 shows the structure of DYCOstrate The core material can be polyimide film with plasma-etched holes, drilled epoxy fiberglass, or other plasmaetchable materials such as liquid crystal polymers Multiple layers can be built up to increase density with the resulting buried and blind vias, but two-sided DYCOstrate structures are also used in products because of the very high density that 0075 mm through holes allow 233412 Manufacturing Process.

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The manufacturing process for a DYCOstrate substrate utilizes common printed circuit board techniques Only the via-generation process is different To produce a plasma-etched via hole, manufacturers use two or three process steps that replace the conventional mechanical drilling-debur-desmear steps: 1 Define photographically the location and geometry of the via holes 2 Etch an opening in the copper foil that will serve as the resist mask 3 For blind vias, reduce the copper-foil thickness to eliminate the copper overhang Figure 2327 shows microsections of a plated through hole and a blind via in polyimide film The plasma-etch procedure is basically an isotropic process, as indicated by the undercut seen on the through hole; considering the actual dimensions, however, this undercut is too small to cause any plating problems.

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When the etching depth is increased, as in the case of a blind via, the resulting undercut is generally too big to allow reliable plating To overcome this problem, the manufacturer can reduce copper use by etching the copper foil, eliminating the copper overhang, and providing a thinner copper foil for fine-line resolution Figure 2328 shows two common products made with the Dycostrate process (a four-layer flex-multilayer chip-on-board (COB) for a hearing aid) and the PERL process (a six-layer FR-4 COB for a networking module)..

The manufacturing process for a DYCOstrate substrate with a standard four-layer buildup is shown in Fig. 23.29. Starting with a prefabricated double-sided DYCOstrate foil, the manufacturer bonds two single-sided copper clad foils to the center-core foil using standard lamination techniques of mass-lam-like process. The resulting four-layer structure is then processed and structured analog to the two-layer foil, producing blind vias instead of through holes. Further refinements in magnetrons for IC manufacturing provide the opportunity for finer plasma-etched vias. Additionally, Dyconex has demonstrated landless vias to be simple and reliable, offering much higher densities at lower cost and simplifying fabrication registration. 23.3.4.2 Plasma Micromilling. The drilling of simple holes is not the only process in which plasma etching is used. Plasma can be also be used to sculpture the surface of the substrate or to fabricate slots, grooves, stepped windows, and more. Even angled vias or tubular systems can be formed.This is useful since cavities can be formed for wire bonding or recessed

mounting of components. A simple definition of the periphery outline by artwork can provide extremely accurate final fabrication, or windows in the final etch step can define areas that will flex. 23.3.4.3 Plasma-Etched Redistribution Layers (PERL). The PERL process was developed by Hewlett Packard to produce microblind and buried vias using the DYCOstrate plasma via process. The materials used are the FR-4 epoxy-coated copper foils (RCC) to replace epoxy-glass prepregs in normal multilayer production. These are copper foils coated with a B-stage epoxy or dual C-stage/B-stage epoxy films. 23.3.4.3.1 Structure. The structure of DYCOstrate PERL is shown in Fig. 23.28. The core material can be standard FR-4 multilayer innerlayers or a through-hole-plated two-sided or multilayer board. Multiple layers can be built up to increase density with the resulting buried and blind vias. Current production ranges from 4 layers to 12 layers with various buried board and buried via constructions. As with DYCOstrate, many materials are plasmaetchable and the resin butter-coated copper foils come in many thicknesses and resin types, such as BT, cyanate ester, and polyphenelene-ether (PPE).

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