rdlc data matrix

rdlc data matrix

rdlc data matrix

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The industry has now released a design guideline document outlining via protection classifications, including the hole fill as described in this chapter The IPC4761, Design Guide for Protection of Printed Board Via Structures, has established via-protection techniques, creating specific types identified as Types I through VII IPC-4761 contains many combinations of techniques where an added material is utilized to plug, tent, cover, or fill a via structure Many of the techniques established are used in Class 1 and 2 hardware or where circuit card assembly consideration is the primary focus Many of the 4761 viaprotection types are of lower cost and lesser complexity than are those used for hole fills The designer is encouraged to consult the application guide included in Table 5-1 of IPC 4761 to narrow the selection prior to layout and specifying a method.

The via fills described in this chapter fall under the Type V and VII classifications These types have been the focus for developing performance-based requirements as reliability data have become available Amendment 1 of the rigid board performance specification IPC-6012B will introduce requirements for maintaining a minimum wrap copper The specification limit is being established at 00005 in minimum wrap as verified at cross section This is considered a conservative value resulting from the nonuniformity of the process Correlation data have revealed that coupons on the panel perimeter rarely match that of the actual product Uniformity of the planarization across the entire panel is difficult, so a conservative value at cross section was established to ensure that the part maintains wrap copper The reliability data gathered support this value due to the additional manufacturing risk that can occur from the added fabrication steps.

However, some data collected in MRB action and assessment indicate that wrap copper as low as 00002 in is acceptable for some end-use environments It is likely that future revisions of.

R = Measured resistance in meg-ohms A = Effective area in square cm T = Average thickness of specimen in cm Surface resistivity s (meg-ohms) s = (R*P)/D (12.6)

a 1 kr 2 ra a t dr d = + a 1 kr 2 ra 1 kr 2 r ra 1 kr 2 a t = r a ra a = t + a d = d (ra sin d )

R = Measured resistance in meg-ohms P = Effective perimeter of electrode in cm D = Width of test gap in cm

12533 Dielectric Strength Breakdown The dielectric strength of a laminate material is its ability to resist electrical breakdown The dielectric strength defines a specific voltage that the laminate resists for a specified time whereas the dielectric breakdown voltage defines the maximum voltage at which the laminate fails These properties can be measured perpendicular to the reinforcement (z-axis) or parallel to the reinforcement (x-y axis) The more important value is the z-axis strength because more and more thin prepreg and laminate cores are being used in high-end multilayer applications The minimum thickness in the laminate is defined as the shortest distance between the copper treatment peaks that needs to resist the desired test voltageThe values for dielectric strength vary with test setup, temperature, humidity, frequency, and wave shape, but are, if tested under controlled conditions, comparable between materials The test method following IPC-TM-650, method 256.

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2, describes the determination of the perpendicular electric strength of laminates Four specimens should be tested The sample size is recommended to be 4 in 4 in with any copper cladding removed Unless otherwise specified, the samples need to be conditioned for 48 hours in distilled water at 50 C After that, the samples are immersed in ambient temperature distilled water for a minimum of 30 min to allow the samples to achieve temperature equilibrium without a substantial change in moisture content The test is performed at ambient temperature (23 C) Relative humidity is not significant as the tests are performed under oil Samples are inserted into the high-voltage test equipment and tested to failure at a 500volts/sec increase The results are reported in volts/mil The test method (see Fig 1210) following IPC-TM-650, method 256, describes the determination of the parallel electric strength of laminates.