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Packaging and Printed Circuit Technology Relationships The packaging density trend lines (package area/die area) are summarized in Fig. 3.3. The area efficiencies of array package concepts are evident and have been maintained over a period of 20 years. It is apparent, then, that the trends for new semiconductor chip packaging are increasing the number of package I/Os. Area array packages for high- I/O semiconductors have emerged to minimize package size and enhance package electrical performance (i.e., lower lead inductance).The impact of this will be pressure on PCB fabricators to minimize linewidth and space in order to escape from high- I/O area array packages or direct chip attach (DCA) semiconductors. In 1986, for PCB interconnects, 6-mil lines and spaces were nominal; in 1992, 8-mil lines and spaces were nominal; in 1995, 6-mil lines and spaces were nominal, and in 2000 4-mil lines and spaces are nominal to meet the interconnect requirements of commercial hand-held electronics products. To meet the needs for a finer-pitch circuit board technology for ball grid array (BGA) packages, chip-scale packages (CSPs), and high-density circuit cards, a new circuit board

FIGURE 3.3 Packaging trends show the area efficiency of array package concepts over a period of 20 years.

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Here is the program you can use to create QR Code image with zxing API. Here is the QR Code image file created by this program . You can use your mobile QR Code scanner app to test it.
Here is the program you can use to create QR Code image with zxing API. Here is the QR Code image file created by this program . You can use your mobile QR Code scanner app to test it.

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BeeTagg QR Reader for Java (en)
BeeTagg QR Reader for Java . The most popular code reader detects BeeTagg Codes, QR Codes ( QR Code ) and Datamatrix. Try now, it's free! (en)

FIGURE 23.21 The parallel-bonded solid via structure of the ALIVH multilayer with cross-sections of examples.

23329 ALIVH The ALIVH (Any Layer Interstitial Via Hole) process has been in development for many years by Matsushita Components of Osaka, Japan The novel process eliminates additive metallization and plating, but defines all features by subtractive etching of the copper foil The build-up process is not sequential, though; it uses layer pairs and aramid-epoxy prepreg with copper-paste vias that can be laminated at one time into a three-dimensional structure CMK (the second largest PCB maker in the world) and other Japanese firms have licensed the process Six to 10 layers have been laminated in this way 233291 Structure Figure 2321 shows the structure and cross-sections for an ALIVH product The PCB consists of laser-produced blind vias The core material is an epoxy-aramid laminate The man-made aramid filaments are ideal to be cut with a CO2 or UV laser.

If the DuPont Kevlar filaments are added, then the resulting material will have a very low coefficient of thermal expansion (CTE)This is useful for mounting ceramic packages and for direct attachment of flip-chip integrated circuits The structure can be as simple as a two-sided PCB or as complex as a many-layered PCB The vias consist of a copper-epoxy paste that connects the top and bottom copper foil If used as a prepreg layer without copper, the vias connect the various ALIVH layer pairs into a multilayer structure This is not a sequential build-up process, but rather a parallel build-up process 233292 Manufacturing Process The ALIVH process is shown in Fig 2322 The process starts with an epoxy-aramid B-stage prepreg The laser cutting of holes can proceed very rapidly.

The material is then printed with a conductive paste of copper and epoxy to fill these holes Copper foil is applied and the structure is laminated to attach the foil and cure the prepreg and conductive pastes that serve as vias The sheet of material is imaged and etched to provide the various circuits Registration is less critical because the vias are now under the surface lands Several of these two-sided layer pairs can be produced, inspected, and tested The two-sided structures can then have additional single layers of B-stage/conductive paste layers with foil laminated to one or both sides, or the B-stage/conductive paste layer can be used to attach a number of layer pairs in one parallel lamination The outside is imaged, etched, and completed as a normal PCB..

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How to Create a QR Code Reader for Your Mobile Website - SitePoint
14 Aug 2017 ... You don't need a native phone app to scan QR codes —it's quite simple to .... To read QR codes we will be using the JavaScript port of the Java ...

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BeeTagg QR Reader for Java (en)
BeeTagg QR Reader for Java. The most popular code reader detects BeeTagg Codes, QR Codes (QR Code) and Datamatrix. Try now, it's free! (en)

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