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, adjacent to or forming the outerlayer, and having microvias to provide interconnection with the balance of the construction), IPC-4104 states that the preferred method for determining Tg and CTE above and below Tg is Test Method 24245 Tg measurement by dynamic mechanical analysis (DMA) determines the elastic modulus (or storage modulus) as a function of temperature, thereby identifying the glass transition region in plastics The Tg is accompanied by a rapid reduction of the flexural strength DMA typically gives Tg values 10 to 15 C higher than DSC DMA has not traditionally been used by the board fabrication industry; however, some evidence suggests that this technique might be a better differentiator for and indicator of a materials inherent thermal stability in the LFA reflow environment since it combines temperature with torsional oscillation.

Additionally, this test has the advantage of being very sensitive and accurate with thin film materials 272222 Time to Delamination (Txxx) Time to delamination is a test to determine the elapsed time at an elevated temperature when a sudden and irreversible expansion, indicative of a delamination, occurs This is at a temperature higher than the Tg of the material Historically this test called for an isothermal temperature of 260 C (hence the abbreviated common test name, T260) until expansion due to delamination is detected by TMA See Fig 271 for an example of a TMA plot For common materials, the T260 varies from a few minutes to hours With the advent of LFA, higher temperatures 288 C and 300 C are now used to evaluate and differentiate materials The test is the same as T260 with the exception of the isothermal temperature.

IPC-4101 RoHS-compliant laminates pass T260 at 30 min minimum,T288 at 15 min minimum, and T300 at 2 min minimum, when tested by TM 24241 272223 Thermal Decomposition Temperature (Td ) The thermal decomposition of a laminate is a test to determine the temperature at which a set weight loss percentage occurs This is indicative of an irreversible degradation of the chemical bonds within the system coincident with the alteration of the laminate s physical properties, or indicative of outgassing of volatile products The mass of the sample is weighed; the sample is then placed in the thermogravimetric analyzer (TGA) The temperature at which there is a 2 percent weight decrease is.

Another application of the symmetries of the Riemann tensor shows us that R = R = +1

Wafer-scale package. (Courtesy of Flipchip Technologies.)

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GTIN-13, EAN - 13 (ITF-14, GS1-128, GS1 DataMatrix, and GS1 QR) ... These all incorporate, at least, a 13-digit number and the check digit is the same as that for ...

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