birt ean 13

birt ean 13

birt ean 13

qr code scanner library report logo, qr code generator freeware labels download para, barcode generator add in free download function, qr code generate add in free how to, 2d generate api labels test virtual,

birt ean 13

birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,

birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,

birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,

birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,

birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,

birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,

birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,

birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,

birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,
birt ean 13,

Chemical cleanliness can be determined in a variety of ways. Wetting is often tested using a water break test or more analytically in terms of contact angle, with a low value being desirable. In addition, analytical techniques (Auger and x-ray photoelectron spectroscopies) can be used to evaluate the chemical composition of the surface (see Table 26.2).14 26.6.2.1 Mechanical Cleaning. Most mechanical cleaning equipment physically abrades the copper surface using a pumice or aluminum oxide slurry either directly (scrubbing or vapor blasting) or impregnated into brushes. Scrubbing provides an even final surface texture, whereas brushing creates grooves (see Fig. 26.7). The copper thickness must be sufficient to provide the desired final conductor height after cleaning. Mechanical cleaning is more difficult for very thin flexible panels.

SOLUTION 5-2 This is a very simple metric. The basis one forms (for the orthonormal basis) are given by = d

FIGURE 26.7 Comparison of the pumice cleaned (a) and mechanically abraded copper surfaces (b), 1200 . (Reprinted with permission of D. P. Seraphim, R. C. Lasky, and C-Y Li, Principles of Electronic Packaging, McGraw-Hill, 1989, p. 383.)

The texture of the mechanically cleaned surface affects the adhesion between the photoresist and the copper.The resist should conform to the topography, and thus, the extent and type of texture must be tailored to the type of photoresist. If the gouges are too deep, a dry film applied with traditional lamination will have difficulty conforming to the surface and create defects: near or full opens after etching, and underplating or shorts after pattern plating. Thus, the cleaning process, photoresist type, and application method must be matched to image at high yields. Conveyorized equipment is used that passes the panels through the brushes or slurry and then to rinse chambers before exiting through a dryer section. If rinsing is insufficient, residual

Figure 127 shows an example of a typical DMA scan The material has a Tg of 19317 C 12522 Coefficient of Thermal Expansion (CTE) The CTE describes the property of materials to expand as they are being heated Because of the reinforced composite construction of most laminates, the CTE in x and y direction is usually different from the CTE in z direction By convention, the x direction corresponds to the warp direction of the reinforcement, whereas the y direction corresponds to the fill direction of the fabric The z direction is the direction perpendicular to the plane of the laminate The difference between the values is caused by the reinforcement, which severely restrains the expansion in x and y, whereas the resin can expand unrestrained in the z direction.

For copper-clad laminate materials used in printed circuit boards, the CTE in x, y, and z direction is of great importance The x and y direction is critical because of all the components that will be mounted on the final printed circuit board The greater the mismatch between the laminate material and the soldered components, the higher the risk that temperature changes will lead to solder fatigue and eventually to a reduction in the reliability of the board The z direction is of equal importance because the expansion of the laminate during thermal cycles will lead to stresses in the copper plating (CTE of 17 ppm/K) of the plated through or buried holes in the board A low z-axis CTE and high Tg are therefore generally desirable for increased through hole reliability A number of different measurement techniques are available to determine the CTE of copper-clad laminates.

The most commonly used is TMA following IPC-TM-650, method 2424C, as described in Section 1221 When determining the CTE of a laminate, the temperature scan must start at a temperature sufficiently lower than the specified temperature range.

for which the CTE is being determined to allow the heat rate to stabilize. The typical scan rate is also 10 C (18 F) per min. and the scan should be continued to at least 250 C (482 F). Because the expansion properties of the material change at Tg, there are usually two CTE values that are being reported: the CTE below Tg is commonly referred to as a1, and the CTE above Tg as a2 (see Eq. 12.4). CTE:a = L/ T ppm/K where L = change in length T = change in temperature K = degrees Kelvin (12.4)

33 A The rst order of business is to choose a topic 12 1 Pick one that is familiar to you and that you nd interesting 16 2 Write down all you know about the topic 13 a Check to see if what you already know can suggest two or three main points that you want to expand 19 b Try to determine what kind of material you need to nd 20 Now that you have laid the groundwork, you are ready to begin your research 11 B Research can begin in the library, but this campus is rich in other resources 35 1 Consult the Reader s Guide to Periodical Literature for current sources on your topic 22 a Don t overlook the Internet as a possible source 6 b Professional publications and manuals may be helpful 24 2.