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The samples need to be preconditioned for 2 hours at 105 C (221 F), then cooled to room temperature in a desiccator for at least a half-hour prior to testing Place the specimen in a standard aluminum sample pan with an aluminum lid For reference purposes, a cover lid crimped onto the sample pan should be used Start the scan at a temperature at least 30 lower than the anticipated onset of Tg Unless otherwise specified, a scan at a rate of 20 C/min (36 F/min) is recommended and the temperature ramp needs to be continued at least 30 C (54 F) above the anticipated transition region The glass transition temperature is determined using the heat flow curve In many cases, the DSC equipment will have applicable software installed to determine Tg.

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A tangent line is fit onto the curve above the transition region, and a second tangent line is fit below the transition region The temperature on the curve halfway between the two tangent lines, or 1/2 d Cp, is the glass transition point Tg Figure 126 shows an example of a DSC scan where the material has been scanned twiceThe Tg of the first scan was 1929 C The second scan yielded a slightly higher value of 1953 C (likely caused by additional curing of the material)..

125213 Tg by Dynamic Mechanical Analysis (DMA) Dynamic mechanical analysis applies an oscillatory stress or strain on the sample while the temperature is increased during the experiment The ability of the material to elastically store the mechanical strain energy changes during the heat cycle as it changes its viscoelastic behavior from glassy to rubbery This property change determines the glass transition temperature by DMA The test procedure is specified in IPC-TM-650, method 24242 The test specimen should consist of a strip of laminate material compatible to the measuring equipment For all samples with woven reinforcement, it is necessary to make sure that the specimens are cut parallel or perpendicular to the woven structure The analysis is based on an assumption of constant specimen geometry; therefore, the test specimens must be stiff enough not to deform plastically during the experiment.

All copper needs to be etched off While the IPC-method recommends preconditioning of the samples at 23 C and 50 percent RH for at least 24 hours prior to testing, the authors recommend preconditioning similar to that employed for TMA or DSC measurements Samples are baked for 2 hours at 105 C (221 F), then cooled to room temperature in a desiccator for at least a half-hour prior to testing The sample is mounted in the fixture making sure that it is perpendicular to the clamps Both clamps are tightened using torque screwdrivers to ensure that the sample does not slip during the measurement and that no stresses have built up around the sample that could negatively influence the results The sample is loaded with a frequency of 1 Hz (6.

28 radian/sec) while it is heated in dry nitrogen or dry air at a rate of no faster than 2 C per min The temperature ramp needs to be continued at least 50 C above the transition region The glass transition temperature is defined as the temperature corresponding to the maximum in the tan d versus temperature curves at a frequency of 1 Hz Tan d is calculated from Eq 123 tan d = E /E (123).

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TABLE 25.3 Spindle Parameters for FR-4 Materials at Various Spindle Speeds Spindle Speed 125,000 RPM Desired Cutting Speed: 500 SFM Tool size (inch) .0071 .0080 .0100 .0120 .0145 Infeed rate (in/min) 054 065 090 105 130 Spindle speed (rpm) 125,000.0 125,000.0 125,000.0 125,000.0 125,000.0 Chip load .00043 .00052 .00072 .00084 .00104 SFM 232 262 327 393 474

Chip Load Chip load is calculated by dividing the feed rate by the spindle speed. The term identifies the amount of penetration the drill bit completes per revolution.As commonly used, the chip load accurately describes the proper cutting action needed to drill certain applications successfully.

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